JPH071792Y2 - ウエーハ貼付装置 - Google Patents
ウエーハ貼付装置Info
- Publication number
- JPH071792Y2 JPH071792Y2 JP1990046843U JP4684390U JPH071792Y2 JP H071792 Y2 JPH071792 Y2 JP H071792Y2 JP 1990046843 U JP1990046843 U JP 1990046843U JP 4684390 U JP4684390 U JP 4684390U JP H071792 Y2 JPH071792 Y2 JP H071792Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- centering
- carrier
- adhesive
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 126
- 239000000853 adhesive Substances 0.000 claims description 28
- 230000001070 adhesive effect Effects 0.000 claims description 28
- 210000000078 claw Anatomy 0.000 claims description 19
- 238000000034 method Methods 0.000 description 9
- 239000000428 dust Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990046843U JPH071792Y2 (ja) | 1990-05-07 | 1990-05-07 | ウエーハ貼付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990046843U JPH071792Y2 (ja) | 1990-05-07 | 1990-05-07 | ウエーハ貼付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH045634U JPH045634U (en]) | 1992-01-20 |
JPH071792Y2 true JPH071792Y2 (ja) | 1995-01-18 |
Family
ID=31562264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990046843U Expired - Lifetime JPH071792Y2 (ja) | 1990-05-07 | 1990-05-07 | ウエーハ貼付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH071792Y2 (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006032661A (ja) * | 2004-07-16 | 2006-02-02 | Disco Abrasive Syst Ltd | 切削装置 |
JP5576173B2 (ja) * | 2010-04-23 | 2014-08-20 | 芝浦メカトロニクス株式会社 | 半導体装置の製造装置 |
KR101383958B1 (ko) * | 2013-01-18 | 2014-04-14 | 주식회사 엘지실트론 | 웨이퍼 마운팅 장치 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0732182B2 (ja) * | 1986-07-29 | 1995-04-10 | 三井東圧化学株式会社 | エピタキシヤル膜の評価方法 |
JPH084105B2 (ja) * | 1987-06-19 | 1996-01-17 | 株式会社エンヤシステム | ウェハ接着方法 |
-
1990
- 1990-05-07 JP JP1990046843U patent/JPH071792Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH045634U (en]) | 1992-01-20 |
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